Product Summary

The CY7C1315BV18-250BZC is a 1.8V Synchronous Pipelined SRAM, equipped with QDR.-II architecture. QDR-II architecture consists of two separate ports to access the memory array. The Read port has dedicated Data Outputs to support Read operations and the Write port has dedicated Data Inputs to support Write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus required with common I/O devices. Access to each port is accomplished through a common address bus. Addresses for Read and Write addresses are latched on alternate rising edges of the input (K) clock. Accesses to the QDR-II Read and Write ports are completely independent of one another. In order to maximize data throughput, both Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with four 36-bit words that burst sequentially into or out of the CY7C1315BV18-250BZC. Since data can be transferred into and out of the CY7C1315BV18-250BZC on every rising edge of both input clocks (K and K and C and C), memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds”.

Parametrics

CY7C1315BV18-250BZC absolute maximum ratings: (1)Storage Temperature:–65℃ to +150℃; (2)Ambient Temperature with Power Applied:–10℃ to +85℃; (3)Supply Voltage on VDD Relative to GND:–0.5V to +2.9V; (4)DC Applied to Outputs in High-Z:–0.5V to VDDQ + 0.3V; (5)DC Input Voltage:–0.5V to VDDQ + 0.3V; (6)Current into Outputs (LOW): 20mA; (7)Static Discharge Voltage (MIL-STD-883, M. 3015): >2001V; (8)Latch-up Current: >200mA.

Features

CY7C1315BV18-250BZC features: (1)Separate Independent Read and Write data ports; (2)Supports concurrent transactions; (3)250-MHz clock for high bandwidth; (4)4-Word Burst for reducing address bus frequency; (5)Double Data Rate (DDR) interfaces on both Read and Write ports (data transferred at 500 MHz) at 250 MHz; (6)Two input clocks (K and K) for precise DDR timing; (7)SRAM uses rising edges only; (8)Two output clocks (C and C) account for clock skew and flight time mismatching; (9)Echo clocks (CQ and CQ) simplify data capture in high-speed systems; (10)Single multiplexed address input bus latches address inputs for both Read and Write ports; (11)Separate Port Selects for depth expansion; (12)Synchronous internally self-timed writes; (13)Available in ?, x9, ?8, and ?6 configurations; (14)Full data coherency providing most current data; (15)Core VDD = 1.8(+/-0.1V); I/O VDDQ = 1.4V to VDD); (16)15×17×1.4 mm 1.0-mm pitch FBGA package, 165-ball (11×15 matrix); (17)Variable drive HSTL output buffers; (18)JTAG 1149.1 compatible test access port; (19)Delay Lock Loop (DLL) for accurate data placemen.

Diagrams

CY7C1315BV18-250BZC block diagram

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